Technical Capacity

Layer Counts

1-24L

Min Board Thickness(2-layer)

 0.2mm

Max board size(mm)

1200x400mm

Min Board Thickness(4-layer)

0.4mm

Max copper

12oz

Min Inner-layer Thickness

0.1mm

Min Trace

0.075mm

Min Pad Ring

0.1mm

Min Clearance

0.075mm

Min Hole Location Tolerance

±0.075mm

Min Hole Size(laser hole)

0.1mm

Min Hole Size Tolerance

±0.05mm

Board Twist

≤ 1°

Min Outer Dimension Tolerance

±0.1mm

Base Material

FR4,High-TG FR4,CEM3,aluminum,High Frequency(Rogers,Taconic,Aron,PTFE,F4B)

Surface Finish

HAL,lead-free HAL,ENIG,Plated Gold,Immersion Gold,OSP

Soldermask

Green, Blue, Black, White, Yellow, Red, Matt Green, Matt Black, Matt Blue

Silkscreen

White, Black, Blue,Yellow

Acceptable File Format

Gerber file,Powerpcb,CAD,AUTOCAD,ORCAD,P-CAD,CAM-350,CAM2000

Certificate

ROSH,ISO9001,UL

Standard
Lead Time

2-layer samples in about 3 days
4-layer samples in about 5 days